히트 파이프 알루미늄 방열판

1. Computer fileds: computer mainboard, PC, IPC, Server, PCTV, Router, Power supply (CPU cooler, VGA cooler, Cooling fan)

2. Home appliances: pico projector, electronic refrigerator, red wine cooler, LASER TV, LCD TV, LED panel, Sound, Air condition, induction cooker, etc.

3. LED lighting: stage light, high bay light, down light, street light, automobile lamp ,etc.

4. Security fields: security cameras, infrared light cameras.

5. Machines: Industry/Medical/Military machines




1.The sample will be shipped by express, like FEDEX, DHL, UPS and EMS.



2. FOB Shenzhen or HongKong for mass production.





1.T/T and L/C,Paypal

2.high value sample will be charged, and will be returned to you after confirming the mass production.

3.low value sample is free, but the freight should be covered by you

 

1. Envelope volume.

2. Bottom thickness of heat sink: A good bottom thickness design must be made from the heat source part to the edge part, so that the heat sink can absorb enough heat from the heat source part and quickly transfer it to the surrounding thinner part.

3. Fin shape: The thickness of the air layer is about 2mm, and the spacing between fins needs to be at least 4mm to ensure smooth natural convection. However, a too small fin spacing will reduce the area of the heat sink.

4. Fin angle: The fin angle is approximately three degrees. Sudden surface drop can increase the heat dissipation area, but in natural convection situations, it may actually cause obstruction to the air layer and reduce efficiency. When the wind direction is uncertain, this design is more appropriate.

5. Increase air flow rate: Cooperate with a fan with high wind speed to achieve the goal.

6. Cross cutting of flat fins: Cut the flat fins into multiple short parts, which will reduce the heat dissipation surface but increase the thermal conductivity and pressure. When the wind direction is uncertain, this design is more appropriate.

7. Needle shaped fin design: Needle shaped fins have the advantages of being lighter and smaller in size, while also having higher volume efficiency. More importantly, they have equal directionality, making them suitable for forced convection fins.

8. Impact flow cooling: By using airflow to impact from the top of the fins to the bottom, this cooling method can increase thermal conductivity, but attention must be paid to the flow direction of the wind in conjunction with the overall design.

인기 탭: , 항공 우주 응용을위한 CPU 쿨러, 판금 접점, 가구 제조를위한 CNC 프로토 타입, 프린터 케이블, 판금 위험, CPU 쿨러 브래킷